Senior Process Engineer (Coring) Jobs in UK 2026

Advanced semiconductor manufacturing continues to create demand for experienced process engineers who can optimise production performance and support next-generation device development. This Senior Process Engineer (Coring) opportunity is designed for professionals with strong wafer processing expertise who can lead process optimisation, improve manufacturing capability, and drive continuous improvement across semiconductor operations.

About the Role

The Senior Process Engineer – Coring position is focused on developing, maintaining, and optimising wafer coring processes that support the manufacture of advanced semiconductor devices. This role combines technical ownership, process optimisation, and cross-functional collaboration to improve process capability, wafer quality, production efficiency, and manufacturing reliability. The successful candidate will contribute to solving complex engineering challenges while supporting stable and scalable production performance.

About the Hiring Organisation

The hiring organisation operates within the semiconductor manufacturing industry and specialises in advanced technologies and precision engineering solutions. Through continuous innovation and investment in manufacturing excellence, the company supports the development and production of next-generation semiconductor products while maintaining a strong focus on quality, operational performance, and engineering advancement.

Job Duties

• Own and maintain wafer coring process performance to achieve quality, cost, throughput, and production targets.
• Define and optimise process parameters and establish process control plans.
• Maintain operating specifications and procedures for wafer coring operations.
• Lead continuous improvement initiatives focused on yield improvement and cost optimisation.
• Monitor process capability metrics and implement corrective improvement actions.
• Investigate technical and quality issues using structured engineering methodologies.
• Provide engineering recommendations for new products and devices under development.
• Collaborate with equipment engineering teams and suppliers to improve equipment reliability.
• Support equipment uptime and manufacturing performance improvements.
• Deliver technical training and engineering support to operations teams.
• Drive defect reduction and cycle time improvement initiatives.

Job Requirements

• Minimum HNC qualification in Electrical, Electronic, or Mechanical Engineering, or equivalent experience.
• Minimum five years of experience in wafer pre-assembly or die preparation processes.
• Hands-on experience with wafer dicing processes.
• Experience in backgrinding, edge grinding, and polishing processes.
• Knowledge of laser grooving and wafer marking operations.
• Strong understanding of wafer coring applications and material selection.
• Knowledge of DOE, SPC, FMEA, OCAP, and data analysis methodologies.
• Strong analytical, technical, and problem-solving capabilities.
• Ability to manage multiple assignments independently and deliver results effectively.

Preferred Qualifications

• Direct experience in wafer coring processes.
• Equipment engineering knowledge and semiconductor tool experience.
• Strong continuous improvement mindset.
• Experience improving manufacturing yield and process stability.
• Ability to support flexible operational requirements and engineering priorities.

#339966;">#339966;" href="https://plessey.pinpointhq.com/en/postings/3e2bc73f-420b-4173-96db-3f9e1a845a2d" target="_blank" rel="noopener">Click Here to Apply

Conclusion

This Senior Process Engineer (Coring) opportunity offers semiconductor professionals the chance to work on advanced wafer manufacturing technologies while influencing process performance and operational excellence. The role combines technical leadership, continuous improvement, cross-functional collaboration, relocation support, and visa sponsorship within a high-performance semiconductor environment.

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